Guoli Wang
Sr Manager at microchip technology inc.
Gather verified email addresses & phone numbers directly from LinkedIn
Sr. Manager
Professional Email
omi****@amkor.com
Personal Email
ozg****@gmail.com
Work Phone
(***) ***-***
Mobile
(***) ***-***
Local Location
Chandler, Arizona, United States
HQ Location
tempe, arizona, united states
Website
http://www.amkor.com
Industry
Appliances, Electrical, and Electronics Manufacturing
Designation
Sr. Manager
Birthday
-
Gender
male
HQ Location
tempe, arizona, united states
Industry
semiconductor manufacturing
Employees
7834
Founded
1968
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25y 5m
Number of Companies Worked For
Number of Job Titles
Average Duration at a Single Company
Years of Professional Experience
Sr Manager at microchip technology inc.
Sr. Manager - System Operations at microchip technology inc.
Sr. Manager at microchip technology inc.
Sr. Manager - Enterprise Applications at krushi seva kendra
Ozgur Misman is currently employed at Amkor technology. Ozgur is an experienced professional working at Amkor Technology, Inc. as the Sr. Manager. Ozgurs phone number is (***) ***-*** and email is omi****@amkor.com to get more information install Sales fuel extension.
Ozgur Misman is currently employed at Amkor technology.
At present, Ozgur Misman is serving as the Sr. Manager.
The professional email used by Ozgur Misman is omi****@amkor.com.
Ozgur Misman's professional contact number is (***) ***-***.
are some of the skills that Ozgur Misman has.
Doug Scott, Ron Schoonejongen, Bob Kuo, Paul Silvestri are some of the colleagues working with Ozgur Misman.
Guoli Wang, Bernardo Cuachin, Robert Tebbs, SheeThong Ho are some of the other counterparts holding the similar designation in other organizations like Ozgur Misman.
Ozgur Misman has worked for amkor technologyfalse so far.
According to the Amkor technology Summary, Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation..
The company is headquartered at Tempe, Arizona, United states.
Ozgur Misman is Sr. Manager at Amkor technology.
Ozgur Misman is currently residing in Chandler, Arizona, United States.
Ozgur Misman is currently working with the Appliances, Electrical, and Electronics Manufacturing industry.
Nearly 7,834 is the total headcount of the company.
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